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Mass production technology for resin microchip devices using injection molding.

Achieving mass production and cost reduction of resin-based microchips and devices through precision processing using injection molding.

We have developed our original resin material. It is a resin composition made from polypropylene-based resin and elastomer-based resin, which excels in precision transferability and can faithfully replicate micro-order unevenness. As a mold stamper, we adopted a substrate that has been etched on a silicon wafer, enabling us to faithfully reproduce the unevenness of the silicon mold, thus achieving mass production of high-precision flow channel molded products. As a material feature, it allows for the joining of multiple structures without the use of adhesives, enabling the creation of bonded structures and micro components. *For more details, please refer to the catalog or feel free to contact us.

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